Atomic layer deposition (ALD) is a promising nanotechnology for wide applications in microelectronics manufacturing due to its ability to control layer growth at atomic scale. Sustainability of ALD technology needs to be quantitatively investigated in this early development stage to improve its economic and environmental performance. In this paper, we present an integrated sustainability analysis of ALD technology through material and energy flow analyses. The study is performed on the ALD of high- dielectric film through trimethylaluminum and water binary reactions. The precursor utilizations, methane emissions, and nanowaste generations from the ALD process are all quantitatively studied. Energy flow analysis demonstrates that the ALD process energy consumption is mainly determined by the ALD cycle time rather than the process temperature. Scale-up performance of the ALD technology is also studied for both emission generations and energy consumptions. Strategies and methods for improving the sustainability performance of the ALD technology are suggested based on the analysis.
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e-mail: chrisyuan@berkeley.edu
e-mail: dornfeld@berkeley.edu
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June 2010
Special Issue On Nanomanufacturing
Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing
Chris Y. Yuan,
Chris Y. Yuan
Department of Mechanical Engineering,
e-mail: chrisyuan@berkeley.edu
University of California, Berkeley
, 5100A Etcheverry Hall, Berkeley, CA 94720-1740
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David A. Dornfeld
David A. Dornfeld
Department of Mechanical Engineering,
e-mail: dornfeld@berkeley.edu
University of California, Berkeley
, 5100A Etcheverry Hall, Berkeley, CA 94720-1740
Search for other works by this author on:
Chris Y. Yuan
Department of Mechanical Engineering,
University of California, Berkeley
, 5100A Etcheverry Hall, Berkeley, CA 94720-1740e-mail: chrisyuan@berkeley.edu
David A. Dornfeld
Department of Mechanical Engineering,
University of California, Berkeley
, 5100A Etcheverry Hall, Berkeley, CA 94720-1740e-mail: dornfeld@berkeley.edu
J. Manuf. Sci. Eng. Jun 2010, 132(3): 030918 (7 pages)
Published Online: June 14, 2010
Article history
Received:
June 15, 2009
Revised:
April 16, 2010
Online:
June 14, 2010
Published:
June 14, 2010
Citation
Yuan, C. Y., and Dornfeld, D. A. (June 14, 2010). "Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing." ASME. J. Manuf. Sci. Eng. June 2010; 132(3): 030918. https://doi.org/10.1115/1.4001686
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