This paper presents the development of a unique, net shape, hot-extrusion process to produce precision, thin-wall, multichannel copper profiles for high efficiency heat-exchangers. This process is a departure from conventional copper extrusion, which is a nonisothermal process used primarily to produce simple semifinished products and hollow profiles requiring cold drawing after hot extrusion. A lab-scale apparatus was developed to simultaneously extrude multiple heated billets through a porthole type hollow die to form the multi-channel profiles. The process is performed at 700–750 °C, essentially at isothermal extrusion conditions. Temperature and tooling strength considerations necessitated the use of superalloys for the apparatus (which included dies, container, ram stems, and support tooling). A 250 kN computer controlled servo-hydraulic MTS® machine was used to provide the extrusion ram force. Two part designs were extruded to demonstrate process feasibility and versatility. A two-channel design with 0.2 mm wall thicknesses and an 11-channel design with wall-thicknesses of 0.3 mm were extruded. The extrusion ratios for these profiles are 67 and 25, respectively. Experimental data and an approach to analytically model the process are presented. Because solid-state welds in the tube walls are necessitated by the use of hollow extrusion dies, the microstructure in these regions is also presented.
Skip Nav Destination
Article navigation
December 2013
Research-Article
Hot Extrusion of Thin-Wall Multichannel Copper Profiles
Jonathan Kochis
Jonathan Kochis
Search for other works by this author on:
Frank F. Kraft
Jonathan Kochis
1Corresponding author.
Manuscript received May 1, 2013; final manuscript received September 18, 2013; published online November 5, 2013. Assoc. Editor: Yung Shin.
J. Manuf. Sci. Eng. Dec 2013, 135(6): 061008 (8 pages)
Published Online: November 5, 2013
Article history
Received:
May 1, 2013
Revision Received:
September 18, 2013
Citation
Kraft, F. F., and Kochis, J. (November 5, 2013). "Hot Extrusion of Thin-Wall Multichannel Copper Profiles." ASME. J. Manuf. Sci. Eng. December 2013; 135(6): 061008. https://doi.org/10.1115/1.4025496
Download citation file:
Get Email Alerts
Cited By
Related Articles
Numerical Modeling of Copper Tube Extrusion: Process and Eccentricity Analysis
J. Manuf. Sci. Eng (October,2012)
Optimum Design of Fatigue Strength of a Cold Extrusion Compound Container
J. Manuf. Sci. Eng (February,2005)
Effect of Severe Prior Deformation on Electrical-Assisted Compression of Copper Specimens
J. Manuf. Sci. Eng (December,2011)
Process Maps for Predicting Residual Stress and Melt Pool Size in the Laser-Based Fabrication of Thin-Walled Structures
J. Manuf. Sci. Eng (February,2007)
Related Proceedings Papers
Related Chapters
Calorimetric Measurement of Temperature Dependent Absorption in Copper
Laser Induced Damage in Optical Materials: 1981
Test Methods
Consensus on Operating Practices for the Sampling and Monitoring of Feedwater and Boiler Water Chemistry in Modern Industrial Boilers (CRTD-81)
Research on Deformation of Aerospace Thin-Walled Structure Part in NC Machining Process
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)