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Journal Articles

Type Synthesis of Three-Degree-of-Freedom Translational Compliant Parallel Mechanisms

Cong Yue, Ying Zhang, Hai-Jun Su, Xianwen Kong
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Research-Article
J. Mechanisms Robotics. August 2015, 7(3): 031012.
Paper No: JMR-14-1014
https://doi.org/10.1115/1.4028758
Published Online: August 1, 2015
View Article titled, Type Synthesis of Three-Degree-of-Freedom Translational Compliant Parallel Mechanisms
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Topics: Bending (Stress), Blades, Chain, Design, Mechanical admittance, Parallel mechanisms, Rotation, Screws, Compliant mechanisms, Finite element analysis
Proceedings Papers

Microstructural Investigation of the Weld HAZ in a Modified 800H Alloy

Carl D. Lundin, Cong-Yue P. Qiao
Proc. ASME. GT1993, Volume 3A: General, V03AT15A053, May 24–27, 1993
Publisher: American Society of Mechanical Engineers
Paper No: 93-GT-202
https://doi.org/10.1115/93-GT-202
View Paper titled, Microstructural Investigation of the Weld HAZ in a Modified 800H Alloy
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Topics: Alloys, Cracking (Materials), Fracture (Process)
Proceedings Papers

Type Synthesis of 3-DOF Translational Compliant Parallel Mechanisms

Cong Yue, Hai-Jun Su, Xianwen Kong
Proc. ASME. IDETC-CIE2013, Volume 6A: 37th Mechanisms and Robotics Conference, V06AT07A032, August 4–7, 2013
Publisher: American Society of Mechanical Engineers
Paper No: DETC2013-12718
https://doi.org/10.1115/DETC2013-12718
View Paper titled, Type Synthesis of 3-DOF Translational Compliant Parallel Mechanisms
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Topics: Parallel mechanisms, Bending (Stress), Screws, Chain, Conceptual design, Deformation, Degrees of freedom, Design, Finite element analysis, Machinery
Proceedings Papers

Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance

Cong Yue, Jun Lu, Xiaotian Zhang, Yueh-Se Ho
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 285-292, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52188
https://doi.org/10.1115/IPACK2011-52188
View Paper titled, Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance
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Topics: Simulation, Wire, Thermal resistance, Finite element model, Gages, Junctions, Natural convection, Power semiconductor devices, Testing, Transistors
Proceedings Papers

Enabling a High Fidelity Dynamics Simulation of CAD Assemblies in a Virtual Environment for Machine Design

Cong Yue, Hai-Jun Su, Juan Camilo Alvarez, Qiaode Jeffrey Ge
Proc. ASME. WINVR2010, ASME 2010 World Conference on Innovative Virtual Reality, 77-85, May 12–14, 2010
Publisher: American Society of Mechanical Engineers
Paper No: WINVR2010-3739
https://doi.org/10.1115/WINVR2010-3739
View Paper titled, Enabling a High Fidelity Dynamics Simulation of CAD Assemblies in a Virtual Environment for Machine Design
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Topics: Computer-aided design, Dynamics (Mechanics), Machine design, Simulation, Virtual reality, Design, Manufacturing, Machinery, Kinematics, Conceptual design