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Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Proceedings Papers

Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Alicia Medina Garcia, John Harris, David R. Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113792
https://doi.org/10.1115/IPACK2023-113792
View Paper titled, Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices
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Topics: Copper, Nanowires, Reliability, Silver, Mechanical properties, High temperature, Resilience, Shear strength, Shear stress, Temperature
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72726
https://doi.org/10.1115/IPACK2021-72726
View Paper titled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Properties of Brassica Carinata and Camelina Sativa Meals and Fast Pyrolysis Derived Bio-Oils

John Harris, James Lawburgh, Brian Lawburgh, Gregory J. Michna, Stephen P. Gent
Proc. ASME. ES2014, Volume 2: Economic, Environmental, and Policy Aspects of Alternate Energy; Fuels and Infrastructure, Biofuels and Energy Storage; High Performance Buildings; Solar Buildings, Including Solar Climate Control/Heating/Cooling; Sustainable Cities and Communities, Including Transportation; Thermofluid Analysis of Energy Systems, Including Exergy and Thermoeconomics, V002T04A003, June 30–July 2, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ES2014-6387
https://doi.org/10.1115/ES2014-6387
View Paper titled, Properties of Brassica Carinata and Camelina Sativa Meals and Fast Pyrolysis Derived Bio-Oils
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Topics: Oils, Petroleum, Pyrolysis, Biomass, Bombs, Calorimetry, Feedstock, Fluidized beds, Particle size, Particulate matter