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M. Y. Tsai
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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
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Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping
Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article titled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

M. Y. Tsai, H. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
https://doi.org/10.1115/1.4051256
Published Online: September 15, 2021
View Article titled, Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test
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Topics: Bending strength, Silicon, Stress, Fittings, Deflection
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Article titled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Proceedings Papers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89337
https://doi.org/10.1115/InterPACK2009-89337
View Paper titled, Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test
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Topics: Junctions, Reliability, Temperature, Thermal resistance
Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33967
https://doi.org/10.1115/IPACK2007-33967
View Paper titled, An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging
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Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)
Proceedings Papers

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73296
https://doi.org/10.1115/IPACK2005-73296
View Paper titled, Novel Test Methods for Die Strength
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Topics: Atomic force microscopy, Design, Electromagnetic scattering, Electronic packaging, Failure, Failure mechanisms, Finite element analysis, Geometry, Grinding, Packaging
Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
View Article titled, Test Methods for Silicon Die Strength
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

M. Y. Tsai, C. H. Hsu, C. N. Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
https://doi.org/10.1115/1.1648056
Published Online: April 30, 2004
View Article titled, A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
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Topics: Manufacturing, Stress, Thermal stresses, Warping, Finite element analysis, Shear (Mechanics), Deformation
Journal Articles

An Experimental Procedure for the Iosipescu Composite Specimen Tested in the Modified Wyoming Fixture

H Ho, M-Y Tsai, J Morton, GL Farley
Journal: Journal of Composites Technology and Research
Publisher: ASTM International
Article Type: Technical Notes
J. Compos. Technol. Res.. March 1993, 15(1): 52–58.
https://doi.org/10.1520/CTR10354J
Published Online: March 1, 1993
View Article titled, An Experimental Procedure for the Iosipescu Composite Specimen Tested in the Modified Wyoming Fixture
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