1-20 of 20
Masataka Mochizuki
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Development of Freeze Resistant Heat Pipe With Water as Working Fluid for Automotive Applications

Ashwin Date, Randeep Singh, Tomoki Oridate, Masataka Mochizuki, Abhijit Date, Aliakbar Akbarzadeh, Sarthak Nag
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2024, 146(10): 101601.
Paper No: HT-23-1444
https://doi.org/10.1115/1.4065419
Published Online: May 22, 2024
View Article titled, Development of Freeze Resistant Heat Pipe With Water as Working Fluid for Automotive Applications
Open the PDF for Development of Freeze Resistant Heat Pipe With Water as Working Fluid for Automotive Applications in another window
Topics: Freezing, Heat pipes, Water, Fluids, Temperature
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48019
https://doi.org/10.1115/IPACK2015-48019
View Paper titled, Hot Spot Elimination by Thin and Smart Heat Spreader
Open the PDF for Hot Spot Elimination by Thin and Smart Heat Spreader in another window
Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis
Proceedings Papers

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48671
https://doi.org/10.1115/IPACK2015-48671
View Paper titled, Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules
Open the PDF for Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules in another window
Topics: Cooling, Heat pipes, Heat sinks, Manufacturing, Air flow, Forced convection, Heat, Heat losses, Telecommunications, Thermal management
Journal Articles

Cooling Performance Evaluation of Synthetic Jet Based Thermal Solution Module

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Randeep Singh, Vijit Wuttijumnong
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2015, 7(3): 031010.
Paper No: TSEA-13-1143
https://doi.org/10.1115/1.4028342
Published Online: September 1, 2015
View Article titled, Cooling Performance Evaluation of Synthetic Jet Based Thermal Solution Module
Open the PDF for Cooling Performance Evaluation of Synthetic Jet Based Thermal Solution Module in another window
Topics: Cooling, Flow (Dynamics), Heat, Heat pipes, Heat sinks, Temperature, Thermal resistance, Performance evaluation, Air jets, Air flow
Journal Articles

Air Impingement Cooling by Synthetic Jet

Ahmad Jalilvand, Masataka Mochizuki, Randeep Singh, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2014, 6(3): 031008.
Paper No: TSEA-13-1057
https://doi.org/10.1115/1.4026219
Published Online: March 17, 2014
View Article titled, Air Impingement Cooling by Synthetic Jet
Open the PDF for Air Impingement Cooling by Synthetic Jet in another window
Topics: Cooling, Heat, Impingement cooling, Heat sinks, Fluidic devices
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73028
https://doi.org/10.1115/IPACK2013-73028
View Paper titled, Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
Open the PDF for Applications of Cold Plate Units With Micro-Channel for Cooling Electronics in another window
Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
https://doi.org/10.1115/IPACK2011-52267
View Paper titled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
Open the PDF for Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan in another window
Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers

Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52265
https://doi.org/10.1115/IPACK2011-52265
View Paper titled, Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers
Open the PDF for Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud Computers in another window
Topics: Computers, Data centers, Energy conservation, Heat pipes, Energy storage, Design, Storage, Water storage, Climate change, Control systems
Proceedings Papers

Data Center Energy Conservation by Heat Pipe Cold Energy Storage System

Xiao Ping Wu, Masataka Mochizuki, Koichi Mashiko, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Gerald Cabusao, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 701-709, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23128
https://doi.org/10.1115/IHTC14-23128
View Paper titled, Data Center Energy Conservation by Heat Pipe Cold Energy Storage System
Open the PDF for Data Center Energy Conservation by Heat Pipe Cold Energy Storage System in another window
Topics: Data centers, Energy conservation, Energy storage, Heat pipes
Proceedings Papers

Development of High Performance Thin Heat Pipe for Cooling Small Form Factor Devices

Masataka Mochizuki, Thang Nguyen, Yuji Saito, Tien Nguyen, Vijit Wuttijumnong, Mohammad Shahed Ahamed
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 453-457, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23127
https://doi.org/10.1115/IHTC14-23127
View Paper titled, Development of High Performance Thin Heat Pipe for Cooling Small Form Factor Devices
Open the PDF for Development of High Performance Thin Heat Pipe for Cooling Small Form Factor Devices in another window
Topics: Cooling, Heat pipes, Operating temperature, Computer technology, Diluents, Electrical measurement, Electronic components, Gravity (Force), Heat transfer, Space
Proceedings Papers

Mathematical Approaches for Thermal Design of a Vapor Chamber

Yasushi Koito, Yuta Shiki, Masataka Mochizuki, Shuichi Torii, Toshio Tomimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 535-544, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89279
https://doi.org/10.1115/InterPACK2009-89279
View Paper titled, Mathematical Approaches for Thermal Design of a Vapor Chamber
Open the PDF for Mathematical Approaches for Thermal Design of a Vapor Chamber in another window
Topics: Design, Vapors, Temperature distribution, Disks, Heat conduction, Momentum, Pressure, Simulation
Proceedings Papers

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen, Xiao Ping, Tien Nguyen, Vijit Wuttijumnong
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89144
https://doi.org/10.1115/InterPACK2009-89144
View Paper titled, Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber
Open the PDF for Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber in another window
Topics: Cooling, Cooling systems, Microchannels, Vapors
Proceedings Papers

Subcooled Flow Boiling in a Minichannel

Akira Oshima, Koichi Suzuki, Chungpyo Hong, Masataka Mochizuki
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 31-36, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82105
https://doi.org/10.1115/ICNMM2009-82105
View Paper titled, Subcooled Flow Boiling in a Minichannel
Open the PDF for Subcooled Flow Boiling in a Minichannel in another window
Topics: Boiling, Flow (Dynamics), Subcooling, Bubbles, Heating, Critical heat flux, Emissions, Heat flux, Ceramics, Copper
Proceedings Papers

Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors

Masataka Mochizuki, Yuji Saito, Fumitoshi Kiyooka, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 695-702, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33611
https://doi.org/10.1115/IPACK2007-33611
View Paper titled, Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors
Open the PDF for Advanced Micro-Channel Vapor Chamber for Cooling High Power Processors in another window
Topics: Cooling, Heat pipes, Microchannels, Vapors
Proceedings Papers

Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Tien Nguyen, Vijit Wuttijumnong, Yasuhiro Horiuchi, Roj Tacomkang, Randeep Singh, Aliakbar Akbarzadeh
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 969-974, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52088
https://doi.org/10.1115/MNHT2008-52088
View Paper titled, Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops
Open the PDF for Development of Miniature Loop Heat Pipes for the Thermal Control of Laptops in another window
Topics: Cooling, Heat pipes, Laptop computers
Journal Articles

Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2009, 131(8): 082601.
https://doi.org/10.1115/1.3109994
Published Online: June 4, 2009
View Article titled, Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe
Open the PDF for Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe in another window
Topics: Copper, Evaporation, Flow (Dynamics), Heat, Heat pipes, Permeability, Porosity, Pressure, Stress, Temperature
Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73286
https://doi.org/10.1115/IPACK2005-73286
View Paper titled, Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application
Open the PDF for Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application in another window
Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux
Proceedings Papers

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 697-702, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73498
https://doi.org/10.1115/IPACK2005-73498
View Paper titled, Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator
Open the PDF for Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator in another window
Topics: Computer cooling, Heat pipes
Proceedings Papers

A Closed Loop Impinging Jet Cooling for Computer Chip

Jemmy Sutanto Bintoro, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 349-355, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43865
https://doi.org/10.1115/IMECE2003-43865
View Paper titled, A Closed Loop Impinging Jet Cooling for Computer Chip
Open the PDF for A Closed Loop Impinging Jet Cooling for Computer Chip in another window
Topics: Cooling, Integrated circuits, Temperature, Cooling systems, Heat exchangers, Heat, Heat flux, Rankine cycle
Journal Articles

Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling

Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Masataka Mochizuki
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2007, 129(10): 1445–1452.
https://doi.org/10.1115/1.2754945
Published Online: February 9, 2007
View Article titled, Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling
Open the PDF for Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling in another window
Topics: Computer cooling, Condensers (steam plant), Cooling, Design, Fluids, Heat, Heat pipes, Stress, Temperature, Thermal resistance