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Michael G. Pecht
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Journal Articles

Sparse Identification of Nonlinear Dynamics-Based Feature Extraction for Data Driven Model Predictive Control of a Buck Boost Switch Mode Power Supply

Declan P. Mallamo, Michael H. Azarian, Michael G. Pecht
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. June 2024, 9(2): 021008.
Paper No: VVUQ-23-1056
https://doi.org/10.1115/1.4065827
Published Online: August 2, 2024
View Article titled, Sparse Identification of Nonlinear Dynamics-Based Feature Extraction for Data Driven Model Predictive Control of a Buck Boost Switch Mode Power Supply
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Topics: Algorithms, Cycles, Dynamics (Mechanics), Errors, Heat conduction, Inductors, Modeling, Nonlinear dynamics, Predictive control, Signals
Journal Articles

Inaugural Editorial

Michael G. Pecht, PhD
Journal: ASME Open Journal of Engineering
Publisher: ASME
Article Type: Editorial
ASME Open J. Engineering. January 2022, 1: 010201.
Paper No: AOJE-21-1094
https://doi.org/10.1115/1.4029154
Published Online: February 24, 2022
View Article titled, Inaugural Editorial
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Topics: Acoustics, Aerospace industry, Arctic engineering, Bioengineering, Biology, Chemistry, Computers, Computers and information in engineering , Cutting, Design engineering
Proceedings Papers

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Takashi Kawakami, Hideo Aoki, Chiaki Takubo, Kuniaki Takahashi, Michael G. Pecht
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 289-303, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13800
https://doi.org/10.1115/IMECE2006-13800
View Paper titled, Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design
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Topics: Ball-Grid-Array packaging, Design, Packaging, Reliability, Thermal stresses, Thermal resistance, Cooling, Deformation, Flat heat pipes, Electronic packaging
Journal Articles

Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application

Michael G. Pecht, Editor, Luu T. Nguyen, Editor, Edward B. Hakim, Editor, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1997, 119(2): 144–145.
https://doi.org/10.1115/1.2792221
Published Online: June 1, 1997
View Article titled, Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application
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Topics: Microelectronic devices, Reliability
Journal Articles

Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

Shrikar Bhagath, Michael G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 404–409.
https://doi.org/10.1115/1.2909349
Published Online: December 1, 1993
View Article titled, Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance
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Topics: Corrosion, Modeling, Relaxation (Physics), Stress, Base metals, Contact resistance, Gold plating, Operating temperature, Reliability, Temperature