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Michael H. Azarian
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Journal Articles

Sparse Identification of Nonlinear Dynamics-Based Feature Extraction for Data Driven Model Predictive Control of a Buck Boost Switch Mode Power Supply

Declan P. Mallamo, Michael H. Azarian, Michael G. Pecht
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. June 2024, 9(2): 021008.
Paper No: VVUQ-23-1056
https://doi.org/10.1115/1.4065827
Published Online: August 2, 2024
View Article titled, Sparse Identification of Nonlinear Dynamics-Based Feature Extraction for Data Driven Model Predictive Control of a Buck Boost Switch Mode Power Supply
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Topics: Algorithms, Cycles, Dynamics (Mechanics), Errors, Heat conduction, Inductors, Modeling, Nonlinear dynamics, Predictive control, Signals
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-92306
https://doi.org/10.1115/IPACK2022-92306
View Paper titled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
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Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2010-3864
https://doi.org/10.1115/SMASIS2010-3864
View Paper titled, Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging
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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation
Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Joseph Varghese, Bo Song, Michael H. Azarian, Abhijit Dasgupta, Michael Pecht
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82428
https://doi.org/10.1115/IMECE2005-82428
View Paper titled, Failure Site Transition During Drop Testing of Printed Wiring Assemblies
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Topics: Ball-Grid-Array packaging, Electrical wires, Failure, Intermetallic compounds, Testing