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P. S. Ayyaswamy
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Proceedings Papers

Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 121-127, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1037
https://doi.org/10.1115/IMECE1996-1037
View Paper titled, Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study
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Topics: Epoxy adhesives, Epoxy resins, Silver, Bonding, Flow (Dynamics)
Proceedings Papers

A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 129-136, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1038
https://doi.org/10.1115/IMECE1996-1038
View Paper titled, A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging
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Topics: Bonding, Flames, Microelectronic packaging, Wire, Heat transfer, Temperature, Transients (Dynamics), Copper, Electric discharge, Grain boundaries
Proceedings Papers

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Srinivas S. Sripada, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 55-61, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0831
https://doi.org/10.1115/IMECE1997-0831
View Paper titled, Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process
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Topics: Anodes, Computation, Flames, Heat transfer, Wire, Melting, Bonding, Computer simulation, Electric arcs, Heat
Proceedings Papers

A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 281-286, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0715
https://doi.org/10.1115/IMECE1998-0715
View Paper titled, A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball
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Topics: Simulation, Solidification, Plasmas (Ionized gases), Wire, Microelectronic packaging, Collisions (Physics), Electric discharge, Energy budget (Physics), Finite volume methods, Flames
Proceedings Papers

A Novel Attitude Control Technique for Miniature Spacecraft

Jun Li, Sung K. Koh, G. K. Ananthasuresh, P. S. Ayyaswamy, S. Ananthakrishnan
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 277-280, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23840
https://doi.org/10.1115/IMECE2001/MEMS-23840
View Paper titled, A Novel Attitude Control Technique for Miniature Spacecraft
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Topics: Microelectromechanical systems, Space vehicles, Microactuators, Actuators, Torque
Proceedings Papers

Modeling of a Nanoparticle Motion in a Newtonian Fluid: A Comparison Between Fluctuating Hydrodynamics and Generalized Langevin Procedures

B. Uma, P. S. Ayyaswamy, R. Radhakrishnan, D. M. Eckmann
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 735-743, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75019
https://doi.org/10.1115/MNHMT2012-75019
View Paper titled, Modeling of a Nanoparticle Motion in a Newtonian Fluid: A Comparison Between Fluctuating Hydrodynamics and Generalized Langevin Procedures
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Topics: Fluids, Hydrodynamics, Modeling, Nanoparticles, Particulate matter, Dynamics (Mechanics), Computation, Computer simulation, Finite element methods, Fluctuations (Physics)
Proceedings Papers

Biotransport: Fluid Mechanics, Heat and Mass Transfer

P. S. Ayyaswamy
Proc. ASME. SBC2011, ASME 2011 Summer Bioengineering Conference, Parts A and B, 129-130, June 22–25, 2011
Publisher: American Society of Mechanical Engineers
Paper No: SBC2011-53178
https://doi.org/10.1115/SBC2011-53178
View Paper titled, Biotransport: Fluid Mechanics, Heat and Mass Transfer
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Topics: Biotransport, Fluid mechanics, Heat, Mass transfer, Students, Undergraduate students
Journal Articles

Nanocarrier–Cell Surface Adhesive and Hydrodynamic Interactions: Ligand–Receptor Bond Sensitivity Study

B. Uma, R. Radhakrishnan, D. M. Eckmann, P. S. Ayyaswamy
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. August 2012, 3(3): 031010.
Paper No: NANO-12-1074
https://doi.org/10.1115/1.4007522
Published Online: January 18, 2013
View Article titled, Nanocarrier–Cell Surface Adhesive and Hydrodynamic Interactions: Ligand–Receptor Bond Sensitivity Study
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Topics: Adhesives, Computer simulation, Dynamics (Mechanics), Fluids, Hydrodynamics, Nanoparticles, Particulate matter, Springs, Temperature, Theorems (Mathematics)
Journal Articles

A Hybrid Approach for the Simulation of the Thermal Motion of a Nearly Neutrally Buoyant Nanoparticle in an Incompressible Newtonian Fluid Medium

B. Uma, R. Radhakrishnan, D. M. Eckmann, P. S. Ayyaswamy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2013, 135(1): 011011.
Paper No: HT-12-1135
https://doi.org/10.1115/1.4007668
Published Online: December 6, 2012
View Article titled, A Hybrid Approach for the Simulation of the Thermal Motion of a Nearly Neutrally Buoyant Nanoparticle in an Incompressible Newtonian Fluid Medium
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Topics: Fluids, Nanoparticles, Particulate matter, Hydrodynamics, Simulation, Computer simulation, Temperature
Journal Articles

Bubble Motion in a Blood Vessel: Shear Stress Induced Endothelial Cell Injury

K. Mukundakrishnan, P. S. Ayyaswamy, D. M. Eckmann
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Technical Briefs
J Biomech Eng. July 2009, 131(7): 074516.
https://doi.org/10.1115/1.3153310
Published Online: July 7, 2009
View Article titled, Bubble Motion in a Blood Vessel: Shear Stress Induced Endothelial Cell Injury
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Topics: Blood vessels, Bubbles, Endothelial cells, Flow (Dynamics), Shear stress, Wounds, Vessels, Vortices, Shear (Mechanics)
Journal Articles

Melting of a Wire Anode Followed by Solidification: A Three-Phase Moving Interface Problem

S. S. Sripada, Ira M. Cohen, P. S. Ayyaswamy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2003, 125(4): 661–668.
https://doi.org/10.1115/1.1576811
Published Online: July 17, 2003
View Article titled, Melting of a Wire Anode Followed by Solidification: A Three-Phase Moving Interface Problem
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Topics: Anodes, Melting, Solidification, Surface tension, Wire, Temperature
Journal Articles

TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes

S. S. Sripada, P. S. Ayyaswamy, I. M. Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1998, 120(4): 939–942.
https://doi.org/10.1115/1.2825913
Published Online: November 1, 1998
View Article titled, TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes
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Topics: Electric arcs, Electrodes, Heat transfer, Plasmas (Ionized gases)
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Article titled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
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Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 34–38.
https://doi.org/10.1115/1.2909299
Published Online: March 1, 1993
View Article titled, Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging
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Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation
Journal Articles

Effect of Polarity on Heat Transfer in the Ball Formation Process

L. J. Huang, M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 33–39.
https://doi.org/10.1115/1.2905364
Published Online: March 1, 1991
View Article titled, Effect of Polarity on Heat Transfer in the Ball Formation Process
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Topics: Heat transfer, Wire, Anodes, Aluminum, Copper, Bonding, Electric discharge, Heat, Pressure, Semiconductors (Materials)
Journal Articles

Effect of Insoluble Surfactants in Condensation on a Moving Drop: Solutions for Intermediate Reynolds Numbers

L. J. Huang, P. S. Ayyaswamy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1991, 113(1): 232–236.
https://doi.org/10.1115/1.2910530
Published Online: February 1, 1991
View Article titled, Effect of Insoluble Surfactants in Condensation on a Moving Drop: Solutions for Intermediate Reynolds Numbers
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Topics: Condensation, Drops, Heat transfer, Reynolds number, Surfactants
Journal Articles

A Note on the Interface Condition in Phase Change Problems

L. J. Huang, P. S. Ayyaswamy, I. M. Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1991, 113(1): 244–247.
https://doi.org/10.1115/1.2910534
Published Online: February 1, 1991
View Article titled, A Note on the Interface Condition in Phase Change Problems
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Topics: Heat conduction