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Phil Geng
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Journal Articles

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010801.
Paper No: EP-18-1046
https://doi.org/10.1115/1.4042800
Published Online: February 25, 2019
View Article titled, Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention
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Topics: Design, Shock (Mechanics), Solder joints, Stress, Structural design, Vibration, Failure, Creep
Journal Articles

Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load

Phil Geng
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. June 2010, 7(6): 1–14.
https://doi.org/10.1520/JAI103044
Published Online: June 1, 2010
View Article titled, Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load
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Proceedings Papers

Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions

Phil Geng, Robert R. Martinson, Richard L. Williams, Michael Mello, Steve Cho
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1583-1586, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73046
https://doi.org/10.1115/IPACK2005-73046
View Paper titled, Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions
Open the PDF for Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions in another window
Topics: Shades and shadows, Warping, Temperature, Creep, Failure mechanisms, Heating, Interferometry, Shapes