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Vikas Gupta
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Journal Articles

An Efficient Numerical Approach to Solve Fractional Coupled Boussinesq Equations

Saurabh Kumar, Vikas Gupta
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research-Article
J. Comput. Nonlinear Dynam. December 2024, 19(12): 121002.
Paper No: CND-24-1038
https://doi.org/10.1115/1.4066389
Published Online: September 21, 2024
View Article titled, An Efficient Numerical Approach to Solve Fractional Coupled Boussinesq Equations
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Topics: Approximation, Errors, Function approximation, Polynomials, Algebra, Iterative methods
Journal Articles

Dynamic Analysis of Hip Prosthesis Using Different Biocompatible Alloys

Tanuj Joshi, Ravikant Sharma, Vinod Kumar Mittal, Vikas Gupta, Gopal Krishan
Journal: ASME Open Journal of Engineering
Publisher: ASME
Article Type: Research Papers
ASME Open J. Engineering. January 2022, 1: 011001.
Paper No: AOJE-21-1012
https://doi.org/10.1115/1.4053417
Published Online: February 24, 2022
View Article titled, Dynamic Analysis of Hip Prosthesis Using Different Biocompatible Alloys
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Topics: Alloys, Biocompatibility, Deformation, Stress, Hip joint prostheses, Finite element analysis, Cycles, Dynamic analysis, Prostheses, Biomaterials
Journal Articles

Heterogeneous Composition Adaptation With Material Convolution Control Features

Vikas Gupta, Puneet Tandon
Journal: Journal of Computing and Information Science in Engineering
Publisher: ASME
Article Type: Research-Article
J. Comput. Inf. Sci. Eng. June 2017, 17(2): 021008.
Paper No: JCISE-16-1075
https://doi.org/10.1115/1.4034741
Published Online: February 16, 2017
View Article titled, Heterogeneous Composition Adaptation With Material Convolution Control Features
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Topics: Modeling, Geometry
eBook Chapter

Aspects of Smart Grid in Indian Scenario

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859919
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Topics: Smart grids
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Proceedings Papers

Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 351-358, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33123
https://doi.org/10.1115/IPACK2007-33123
View Paper titled, Reliability Modeling of Lead Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Lead-free solders, Modeling, Reliability, Semiconductor wafers, Fatigue, Constitutive equations, Creep, Errors, Density, Finite element methods
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
https://doi.org/10.1115/IPACK2007-33629
View Paper titled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials
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Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Journal Articles

Modeling of Surface Modified Layers in the Presence of Surface Irregularities

Vikas Gupta, George T. Hahn, Pedro Bastias, Carol A. Rubin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 1996, 118(4): 753–758.
https://doi.org/10.1115/1.2831604
Published Online: October 1, 1996
View Article titled, Modeling of Surface Modified Layers in the Presence of Surface Irregularities
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Topics: Bearing steel, Cylinders, Deformation, Finite element analysis, Flow (Dynamics), Hardening, Kinematics, Mechanical properties, Modeling, Rolling contact