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Yoonjin Won
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Journal Articles

Multi-Fidelity Design of Porous Microstructures for Thermofluidic Applications

Jonathan Tammer Eweis-Labolle, Chuanning Zhao, Yoonjin Won, Ramin Bostanabad
Journal: Journal of Mechanical Design
Publisher: ASME
Article Type: Research Papers
J. Mech. Des. October 2024, 146(10): 101705.
Paper No: MD-23-1728
https://doi.org/10.1115/1.4064813
Published Online: March 18, 2024
View Article titled, Multi-Fidelity Design of Porous Microstructures for Thermofluidic Applications
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Topics: Design, Modeling
Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Proceedings Papers

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96542
https://doi.org/10.1115/IPACK2022-96542
View Paper titled, Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions
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Topics: Autonomous vehicles, Machine learning
Proceedings Papers

A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles

Nicholas Choi, Nhi V. Quach, Yoonjin Won
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69751
https://doi.org/10.1115/IPACK2021-69751
View Paper titled, A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles
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Topics: Batteries, Cooling, Electric vehicles, Energy dissipation, Heat, Thermal management
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Kimia Montazeri, Penghui Cao, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2699
https://doi.org/10.1115/IPACK2020-2699
View Paper titled, Molecular Dynamics Investigation of Water Behavior Through Nanopores
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Topics: Density, Molecular dynamics, Nanopores, Water, Nanoscale phenomena, Dimensions, Dynamics (Mechanics), Energy storage, Engineering systems and industry applications, Fluids
Journal Articles

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031105.
Paper No: EP-19-1137
https://doi.org/10.1115/1.4046767
Published Online: April 17, 2020
View Article titled, Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence
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Topics: Evaporation, Fluorescence, Temperature, Vapors, Microscale devices
Includes: Supplementary data
Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6307
https://doi.org/10.1115/IPACK2019-6307
View Paper titled, Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
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Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
View Article titled, Evaporative Wicking Phenomena on Nanotextured Surfaces
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8456
https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Article titled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74090
https://doi.org/10.1115/IPACK2017-74090
View Paper titled, Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer
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Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48670
https://doi.org/10.1115/IPACK2015-48670
View Paper titled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48409
https://doi.org/10.1115/IPACK2015-48409
View Paper titled, Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling
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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Thermoelectric Characterization of Ge 2 Sb 2 Te 5 Films for Phase-Change Memory

Jaeho Lee, Takashi Kodama, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 687-693, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75092
https://doi.org/10.1115/MNHMT2012-75092
View Paper titled, Thermoelectric Characterization of Ge 2 Sb 2 Te 5 Films for Phase-Change Memory
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Topics: Crystallization, Electromagnetic scattering, Engineering simulation, Film thickness, Grain boundaries, Optimization, Phase change materials, Radiation scattering, Scattering (Physics), Simulation