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Zs. Benedek
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Journal Articles

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Zs. Benedek, B. Courtois, G. Farkas, E. Kolla´r, S. Mir, A. Poppe, M. Rencz, V. Sze´kely, K. Torki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 323–330.
https://doi.org/10.1115/1.1389846
Published Online: June 2, 2001
View Article titled, A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation
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Topics: Design, Sensors, Temperature, Energy dissipation, Transients (Dynamics), Packaging, Resistors, Composite materials, Complementary metal oxide semiconductors