...Claudia Funke; Susann Wolf; Dietrich Stoyan Solar silicon wafers are mainly produced through multiwire-sawing. This sawing implies microcracks on the wafer surface, which are responsible for brittle fracture. In order to reduce the sawing-induced cracks, the wafers are damage etched after sawing...

... growth, the wafer preparation, and the wafer etching. Subsequent steps after these are related to the p ∕ n or n ∕ p junction elaboration. Some results obtained for different thin-layer elaboration approaches are presented. So from the simple vapor phase diffusion process or the liquid phase epitaxy...