Abstract

The X-ray method is used extensively to determine the residual stress in bulk or thin film materials on the assumptions that the material is composed of fine crystals with random orientation and the stress state is biaxial and homogeneous through the X-ray penetrating region. But the method cannot be used in textured films due to oscillations in ε -sin2 Ψ relation. In this paper, a new method is proposed for measuring residual stress in cubic films with any [hkl] fiber texture.

References

1.
Børgesen
,
P.
,
Lee
,
J. K.
,
Gleixner
,
R.
, and
Li
,
C.-Y.
, “
Thermal Stress-Induced Voiding in Narrow Passivated Cu Lines
,”
Appl. Phys. Lett.
 0003-6951 https://doi.org/10.1063/1.106449, Vol.
60
,
1992
, pp.
1076
-
1708
.
2.
Vinci
,
R. P.
,
Marieb
,
T. N.
, and
Bravman
,
J. C.
, “
Non-Destructive Evaluation of Strains and Voiding in Passivated Copper Metallizations
,”
Materials Research Society Symposium Proceedings
, Vol.
308
,
1993
, pp.
297
-
302
.
3.
Zhang
,
J. M.
and
Xu
,
K. W.
, “
Yield Strengths and Stress Induced Crackles in Copper Films: Effects of Substrate and Passivated Layer
,”
Chin. Phys.
 1009-1963, Vol.
13
,
2004
, pp.
205
-
211
.
4.
Kusaka
,
K.
,
Hanabusa
,
T.
,
Nishida
,
M.
, and
Inoko
,
F.
, “
Residual Stress and In-Situ Thermal Stress Measurement of Aluminum Film Deposited on Silicon Wafer
,”
Thin Solid Films
 0040-6090, Vol.
290–291
,
1996
, pp.
248
-
253
.
5.
Murarka
,
S. P.
, “
Multievel Interconnections of ULSI and GSI Era
,”
Materials Science and Engineering R: Reports
, Vol.
19
,
1997
, pp.
87
-
151
.
6.
Shute
,
C. J.
and
Cohen
,
J. B.
, “
Determination of Yielding and Debonding in Al-Cu Thin Films from Residual Stress Measurement via Diffraction
,”
J. Mater. Res.
 0884-2914, Vol.
6
,
1991
, pp.
950
-
956
.
7.
Zhang
,
J. M.
,
Xu
,
K. W.
, and
Guelorget
,
B.
, “
Effect of Loading Schemes on Depth-Sensing Indentation Tests
,”
J. Test. Eval.
 0090-3973, Vol.
32
,
2004
, pp.
504
-
507
.
8.
Hauk
,
V. M.
, “
Stress Evaluation on Materials Having Non-Linear Lattice Strain Distribution
,”
Adv. X-Ray Anal.
 0376-0308, Vol.
27
,
1983
, pp.
101
-
113
.
9.
Noyan
,
I. C.
and
Cohen
,
J. B.
, “
Determine Stresses in the Presence of Non-Linearities in Interplanar Spacing vs. sin2 Ψ
,”
Adv. X-Ray Anal.
 0376-0308, Vol.
27
,
1983
, pp.
129
-
135
.
10.
Dölle
,
H.
, “
The Influence of Multiaxial Stress States, Stress Gradients and Elastic Anisotropy on the Evaluation of (Residual) Stresses by X-Rays
,”
J. Appl. Crystallogr.
 0021-8898 https://doi.org/10.1107/S0021889879013169, Vol.
12
,
1979
, pp.
489
-
501
.
11.
Noyan
,
I. C.
, “
Effect of Gradients in Multi-Axial Stress State on Residual Stress Measurements with X-Rays
,”
Metall. Trans. A
 0360-2133, Vol.
14
,
1983
, pp.
249
-
258
.
12.
Brakman
,
C. M.
, “
Residual Stresses in Cubic Materials with Monoclinic Specimen Symmetry: Influence of Texture on Ψ-Splitting and Non-Linear Behavior
,”
J. Appl. Crystallogr.
 0021-8898, Vol.
16
,
1983
, pp.
325
-
340
.
13.
Xu
,
K. W.
and
He
,
J. W.
, “
Microstrain-Induced Additional Peak Shift and Method for Determinating Macrostress in Plasma-Assisted CVD Coatings
,”
Surface and Coatings Technology
, Vol.
70
,
1994
, pp.
115
-
120
.
14.
Huang
,
T. C.
,
Lim
,
G.
,
Parmigiani
,
F.
, and
Kay
,
E.
, “
Effect of Ion Bombardment during Deposition on the X-Ray Microstructure of Thin Silver Films
,”
J. Vac. Sci. Technol. A
 0734-2101 https://doi.org/10.1116/1.573271, Vol.
3
,
1985
, pp.
2161
-
2166
.
15.
Ohmi
,
T.
,
Saito
,
T.
,
Shibata
,
T.
, and
Nitta
,
T.
, “
Room-Temperature Copper Metallization for Ultralarge-Scale Integrated Circuits by a Low Kinetic-Energy Particles Process
,”
Appl. Phys. Lett.
 0003-6951 https://doi.org/10.1063/1.99542, Vol.
52
,
1988
, pp.
2236
-
2238
.
16.
Kim
,
S. P.
,
Choi
,
H. M.
, and
Choi
,
S. K.
, “
A Study on the Crystallographic Orientation with Residual Stress and Electrical Property of Al Films Deposited by Sputtering
,”
Thin Solid Films
 0040-6090 https://doi.org/10.1016/S0040-6090(97)00926-7, Vol.
322
,
1998
, pp.
298
-
320
.
17.
Nam
,
H. S.
and
Lee
,
D. N.
, “
Recrystallization Textures of Silver Electrodeposits
,”
J. Electrochem. Soc.
 0013-4651 https://doi.org/10.1149/1.1392471, Vol.
146
,
1999
, pp.
3300
-
3308
.
18.
Lee
,
D. N.
, “
Textures and Structures of Vapor Deposits
,”
J. Mater. Sci.
 0022-2461, Vol.
34
,
1999
, pp.
2575
-
2582
.
19.
Zhang
,
J. M.
,
Xu
,
K. W.
, and
Ji
,
V.
, “
Dependence of Strain Energy on the Grain Orientations in a FCC-Polycrystalline Film on Rigid Substrate
,”
Applied Surface Science
, Vol.
185
,
2002
, pp.
177
-
182
.
20.
Zhang
,
J. M.
,
Ma
,
F.
, and
Xu
,
K. W.
, “
Calculation of the Surface Energy of FCC Metals with Modified Embedded-Atom Method
,”
Applied Surface Science
, Vol.
229
,
2004
, pp.
34
-
42
.
21.
Nye
,
J. F.
,
Physical Properties of Crystals
,
Clarendon Press
,
Oxford
,
1972
, p. 131.
22.
Chollet
,
L.
and
Perry
,
A. J.
, “
The Stress in Ion-Plated HfN and TiN Coatings
,”
Thin Solid Films
 0040-6090, Vol.
123
,
1985
, pp.
223
-
234
.
23.
Quaeyhaegens
,
C.
,
Knuyt
,
G.
, and
Stals
,
L. M.
, “
Residual Macroscopic Stress in Highly Preferentially Oriented Titanium Nitride Coatings Deposited on Various Steel Types
,”
J. Vac. Sci. Technol. A
 0734-2101 https://doi.org/10.1116/1.580037, Vol.
14
,
1996
, pp.
2462
-
2469
.
This content is only available via PDF.
You do not currently have access to this content.