The contact temperature plays an important role in the polishing process, which essentially is a surface contact abrasion process. This paper reports a contact temperature model to predict the temperature rise of both the abrasive-workpiece and pad-workpiece interfaces in a polishing process. In this analysis, the forces acting on an abrasive particle and an asperity of the pad are derived from a mechanistic analysis of abrasive-workpiece and pad-workpiece contact. Our results elucidate that polishing with a rigid, smooth plate is a special case of our purposed model. Theoretical predictions indicate that the temperature rise of abrasive-workpiece contact increases with an increase in particle size and density of particles, hardness of workpiece, hardness of pad, and with a decrease in thermal conductivity of workpiece. The temperature of pad-workpiece contact increases with an increase in hardness of pad and surface roughness of pad, and with a decrease in thermal conductivity of workpiece. The contact temperature rise of the pad-workpiece interface is independent of the hardness of workpiece. For a metal polishing process, the maximum contact temperature occurs at the pad-workpiece contact point for small abrasive particles and rough polishing pad with high hardness.
Skip Nav Destination
e-mail: imeyrj@ccu.edu.tw
Article navigation
July 2004
Technical Papers
A Model for Temperature Rise of Polishing Process Considering Effects of Polishing Pad and Abrasive
Jeng-Haur Horng,
Jeng-Haur Horng
Department of Power Mechanical Engineering, National Huwei Institute of Technology, Huwei, Yunlin 632, Taiwan
Search for other works by this author on:
Yeau-Ren Jeng,
e-mail: imeyrj@ccu.edu.tw
Yeau-Ren Jeng
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan
Search for other works by this author on:
Chun-Liang Chen
Chun-Liang Chen
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan
Search for other works by this author on:
Jeng-Haur Horng
Department of Power Mechanical Engineering, National Huwei Institute of Technology, Huwei, Yunlin 632, Taiwan
Yeau-Ren Jeng
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan
e-mail: imeyrj@ccu.edu.tw
Chun-Liang Chen
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan
Contributed by the Tribology Division for publication in the ASME JOURNAL OF TRIBOLOGY. Manuscript received by the Tribology Division January 28, 2003; revised manuscript received September 18, 2003. Associate Editor: L. Chang.
J. Tribol. Jul 2004, 126(3): 422-429 (8 pages)
Published Online: June 28, 2004
Article history
Received:
January 28, 2003
Revised:
September 18, 2003
Online:
June 28, 2004
Citation
Horng, J., Jeng, Y., and Chen, C. (June 28, 2004). "A Model for Temperature Rise of Polishing Process Considering Effects of Polishing Pad and Abrasive ." ASME. J. Tribol. July 2004; 126(3): 422–429. https://doi.org/10.1115/1.1705665
Download citation file:
Get Email Alerts
Related Articles
Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves
J. Tribol (July,2006)
Examination of Selective Pulsed Laser Micropolishing on Microfabricated Nickel Samples Using Spatial Frequency Analysis
J. Manuf. Sci. Eng (April,2009)
The Effect of Laser Pulse Duration and Feed Rate on Pulsed Laser Polishing of Microfabricated Nickel Samples
J. Manuf. Sci. Eng (June,2009)
A Quasi-Static Mechanics Analysis of Three-Dimensional Nanoscale Surface Polishing
J. Manuf. Sci. Eng (June,2010)
Related Proceedings Papers
Related Chapters
Influence of Particle Size and Temperature on Gasification Performance in Externally Heated Gasifier
International Conference on Software Technology and Engineering, 3rd (ICSTE 2011)
Automated Robotic Polishing Using a Direct Teaching and Playback Method
Proceedings of the 2010 International Conference on Mechanical, Industrial, and Manufacturing Technologies (MIMT 2010)
Effective Innovation—Benefits
Effective Innovation: The Development of Winning Technologies